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Technical University of Crete
Technical University of Crete
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| URI | http://purl.tuc.gr/dl/dias/D4825E0C-67AD-450E-B68B-16AD8DC31F29 | - |
| Identifier | https://doi.org/10.3390/app13052774 | - |
| Identifier | https://www.mdpi.com/2076-3417/13/5/2774 | - |
| Language | en | - |
| Extent | 17 pages | en |
| Title | Band gap analysis for materials with cookie-shaped auxetic microstructures, using finite elements | en |
| Creator | Chinis Dimitrios | en |
| Creator | Χηνης Δημητριος | el |
| Creator | Stavroulakis Georgios | en |
| Creator | Σταυρουλακης Γεωργιος | el |
| Publisher | MDPI | en |
| Description | Featured Application The production of materials with microstructures becomes feasible in view of additive manufacturing technology. Easily produced cookie-shaped auxetic microstructures are able to block the propagation of waves at specific frequencies, as is demonstrated here with extensive numerical models based on finite elements. | en |
| Content Summary | Microstructures, including auxetic ones, influence the overall behavior of a material. Particularly during wave propagation, band gaps may appear. This study focuses on the discovery and analysis of the band gaps that occur in a material with auxetic microstructures of the cookie type, which have certain advantages with respect to production and fatigue resistance. Finite element analysis at a representative volume element, using Bloch theory, and verification with a plate made of microstructures at various assemblages has been used. | en |
| Type of Item | Peer-Reviewed Journal Publication | en |
| Type of Item | Δημοσίευση σε Περιοδικό με Κριτές | el |
| License | http://creativecommons.org/licenses/by/4.0/ | en |
| Date of Item | 2025-02-21 | - |
| Date of Publication | 2023 | - |
| Subject | Auxetic materials | en |
| Subject | Band gap analysis | en |
| Subject | Bloch theory | en |
| Subject | Mechanical metamaterials | en |
| Subject | Finite element applications | en |
| Bibliographic Citation | D. Chinis and G. E. Stavroulakis, “Band gap analysis for materials with cookie-shaped auxetic microstructures, using finite elements,” Appl. Sci., vol. 13, no. 5, Feb. 2023, doi: 10.3390/app13052774. | en |
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