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Sputtering rates and nanoscale cluster production in a hollow-cathode apparatus

Katsanos Anastasios, Clouvas, Alexandre, 19..-, Papastaikoudis, Constantin, Potiriadis Constantinos , Trouposkiadis P., Xenoulis Alexander C.

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URIhttp://purl.tuc.gr/dl/dias/B75148A9-8FAC-45DA-A019-A7D1EC511304-
Identifierhttp://www.sciencedirect.com/science/article/pii/0965977396000293-
Identifierhttps://doi.org/10.1016/0965-9773(96)00029-3-
Languageen-
Extent14 pagesen
TitleSputtering rates and nanoscale cluster production in a hollow-cathode apparatusen
CreatorKatsanos Anastasiosen
CreatorΚατσανος Αναστασιοςel
CreatorClouvas, Alexandre, 19..-en
CreatorPapastaikoudis, Constantinen
CreatorPotiriadis Constantinos en
CreatorTrouposkiadis P.en
CreatorXenoulis Alexander C.en
PublisherElsevieren
Content SummaryBy combining a hollow-cathode plasma sputter device with the gas aggregation technique, an intense source of nanoscale metal clusters has been developed. Net sputtering rates have been measured as a function of pressure, flow velocity, electric current and cathode geometry, and in most instances they were found to behave differently than their planar-electrode sputtering counterparts. Deposition rates on substrates located away from the hot plasma region have been also measured. Clusters of Cu, Ag, Au and Ta have been produced and their size has been determined via XRD and TEM. The size of Cun clusters is found to increase with the sputter source discharge current.en
Type of ItemPeer-Reviewed Journal Publicationen
Type of ItemΔημοσίευση σε Περιοδικό με Κριτέςel
Licensehttp://creativecommons.org/licenses/by/4.0/en
Date of Item2015-12-02-
Date of Publication1996-
SubjectNanostructured materialsen
Bibliographic CitationA. C. Xenoulis, P. Trouposkiadis, C. Potiriadis, C. Papastaikoudis, A. A. Katsanos, and A. Clouvas, "Sputtering rates and nanoscale cluster production in a hollow-cathode apparatus", Nanostruct. Mater., vol. 7, no. 5, pp. 473-486, Jul. 1996. doi: 10.1016/0965-9773(96)00029-3en

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