Aggelos Papadimitriou, "Integrated mmWave FEM For 5G Communications", Master Thesis, School of Electrical and Computer Engineering, Technical University of Crete, Chania, Greece, 2020
https://doi.org/10.26233/heallink.tuc.84478
In just the past year, preliminary interest and discussions about a possible 5G standard have evolved into a fullfledged conversation that has captured the attention and imagination of researchers and engineers around the world. This thesis presents an integrated front end module intended for use in 5th generation communications transceivers. The chip that has been designed includes a two stage cascode common source low noise amplifier and a five stack power amplifier. The low noise amplifier achieves a maximum small signal gain of 16.5dB and noise figure of 4.01dB, while the power amplifier achieves a maximum saturated power of 19dBm and a maximum power added efficiency of 30%. The total area of the testchip is roughly 3.3mm2 including the DC and RF testpads.