Ιδρυματικό Αποθετήριο
Πολυτεχνείο Κρήτης
Πολυτεχνείο Κρήτης
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| URI | http://purl.tuc.gr/dl/dias/6A16A89F-F1CB-418E-B433-8790C9D12405 | - |
| Αναγνωριστικό | https://doi.org/10.1145/3415264.3425457 | - |
| Αναγνωριστικό | https://dl.acm.org/doi/10.1145/3415264.3425457 | - |
| Γλώσσα | en | - |
| Μέγεθος | 2 pages | en |
| Τίτλος | Wireless embedded system on a glove for hand motion capture and tactile feedback in 3D environments | en |
| Δημιουργός | Effraimidis Michail | en |
| Δημιουργός | Ευφραιμιδης Μιχαηλ | el |
| Δημιουργός | Mania Aikaterini | en |
| Δημιουργός | Μανια Αικατερινη | el |
| Εκδότης | Association for Computing Machinery (ACM) | en |
| Περιγραφή | 13th ACM SIGGRAPH conference and exhibition on computer graphics and interactive techniques in Asia, virtual event, Republic of Korea, December 4 - 13, 2020 | en |
| Περίληψη | Wearable haptics, compatible with Virtual Reality applications for remote interaction, are still heavily reliant on cumbersome wired systems, restricting user movement. We present an innovative, component-based, wireless embedded system on a glove with hand motion capture providing tactile feedback, operating without the need for a finger tracking device such as the Leap Motion. The user’s hand is tracked by an infrared filter pass camera which detects three infrared LEDs attached on the 3D printed base on the glove. The system is built using inexpensive parts making it ideal for prototyping and customization, therefore resulting to a scalable and upgradable system. | en |
| Τύπος | Αφίσα σε Συνέδριο | el |
| Τύπος | Conference Poster | en |
| Άδεια Χρήσης | http://creativecommons.org/licenses/by/4.0/ | en |
| Ημερομηνία | 2021-12-21 | - |
| Ημερομηνία Δημοσίευσης | 2020 | - |
| Θεματική Κατηγορία | Infrared tracking | en |
| Θεματική Κατηγορία | Embedded systems | en |
| Θεματική Κατηγορία | 3D environments | en |
| Θεματική Κατηγορία | Haptics | en |
| Βιβλιογραφική Αναφορά | M. Efraimidis and K. Mania, “Wireless embedded system on a glove for hand motion capture and tactile feedback in 3D environments”, in SIGGRAPH Asia 2020, pp. 1–2. doi: 10.1145/3415264.3425457 | en |
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