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Single-phase transformerless PV inverter topology with AC bypass and mid-DC-link voltage clamping

Orfanoudakis, G. I, Sharkh, S. M, Koutroulis Eftychios, Yuratich, M. A

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URIhttp://purl.tuc.gr/dl/dias/C86A15E9-EEFA-408A-A16F-B16F0554CE76-
Identifierhttp://ieeexplore.ieee.org/document/8098973/-
Identifierhttps://doi.org/10.23919/EPE17ECCEEurope.2017.8098973-
Languageen-
TitleSingle-phase transformerless PV inverter topology with AC bypass and mid-DC-link voltage clampingen
CreatorOrfanoudakis, G. Ien
CreatorSharkh, S. Men
CreatorKoutroulis Eftychiosen
CreatorΚουτρουλης Ευτυχιοςel
CreatorYuratich, M. Aen
PublisherInstitute of Electrical and Electronics Engineersen
Content SummaryTransformerless PV inverters are known to generate undesirable ground leakage currents due to the lack of galvanic isolation between the PV array and the electric grid. This paper initially discusses the different types of transformerless PV inverter topologies that have been proposed to overcome this problem. It then proposes a new topology, which extends the commercially successful HERIC inverter with the addition of a mid-DC-link clamping configuration. Such configurations are known to cause a highly desirable reduction of the ground leakage currents, which is demonstrated through simulation results from MATLAB-Simulink and PLECS. The proposed topology is finally compared to other transformerless topologies with respect to other aspects, such as efficiency and component count.en
Type of ItemΠλήρης Δημοσίευση σε Συνέδριοel
Type of ItemConference Full Paperen
Licensehttp://creativecommons.org/licenses/by/4.0/en
Date of Item2018-03-16-
Date of Publication2017-
SubjectConverter circuiten
SubjectPhotovoltaicen
SubjectSolar cell systemen
SubjectSustainable system/technologyen
SubjectVSIen
SubjectVoltage source invertersen
Bibliographic CitationG. I. Orfanoudakis, S. M. Sharkh, E. Koutroulis and M. A. Yuratich, "Single-phase transformerless PV inverter topology with AC bypass and mid-DC-link voltage clamping," in 19th European Conference on Power Electronics and Applications, 2017. doi:10.23919/EPE17ECCEEurope.2017.8098973en

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